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  this is information on a product in full production. september 2013 docid024454 rev 1 1/10 10 STTH30R04-Y automotive ultrafast recovery diode datasheet - production data features ? ultrafast switching ? low reverse current ? low thermal resistance ? reduces switching and conduction losses ? high junction temperature ? aec-q101 qualified ? ecopack ? 2 compliant component description the compromise-free, high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. these characteristics make it ideal for heavy duty applications that demand long term reliability. table 1. device summary symbol value i f(av) 30 a v rrm 400 v t j (max) 175 c v f (typ) 1.0 v t rr (typ) 24 ns k a k a k a to-220ac stth30r04dy do-247 stth30r04wy www.st.com
characteristics STTH30R04-Y 2/10 docid024454 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.95 x i f(av) + 0.01 x i f 2 (rms) table 2. absolute ratings (limiting values at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 400 v i f(rms) rms forward current 50 a i f(av) average forward current, = 0.5 to-220ac / do-247 t c = 135 c 30 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 280 a t stg storage temperature range -65 to +175 c t j operating junction temperature range -40 to +175 c table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case to-220ac / do-247 0.8 c/w table 4. static electrical characteristics symbol parameter test conditions min typ max unit i r (1) reverse leakage current t j = 25 c v r = v rrm 15 a t j = 100 c 3 30 t j = 125 c 15 150 v f (2) forward voltage drop t j = 25 c i f = 15 a 1.35 v t j = 150 c 0.83 1.04 t j = 25 c i f = 30 a 1.55 t j = 100 c 1.32 t j = 150 c 1.0 1.25 1. pulse test: t p = 5 ms, < 2 % 2. pulse test: t p = 380 s, < 2 %
docid024454 rev 1 3/10 STTH30R04-Y characteristics table 5. dynamic characteristics symbol parameter test conditions min typ max unit t rr reverse recovery time i f = 1 a, di f /dt = -200 a/s, v r = 30 v, t j = 25 c 24 35 ns i f = 1 a, di f /dt = -15 a/s, v r = 30 v, t j = 25 c 73 100 i f = 1 a, i r = 1 a, i rr = 0.25 a, t j = 25 c 45 i rm reverse recovery current i f = 30 a, di f /dt = -200 a/s, v r = 320 v, t j = 125 c 10 14 a t fr forward recovery time i f = 30 a di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 500 ns v fp forward recovery voltage i f = 30 a di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 2.9 v figure 1. conduction losses versus average current figure 2. forward voltage drop versus forward current 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 p f(av) (w) t  =tp/t tp i f(av) (a)  = 0.05  = 0.1  = 0.2  = 0.5  = 1 i fm (a) 0.1 1.0 10.0 100.0 1000.0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 v fm (v) t j =25c t j =25c (maximum values) t j =150c (typical values) t j =150c (typical values) t j =150c (maximum values) t j =150c (maximum values) figure 3. relative variation of thermal impedance junction to case versus pulse duration figure 4. peak reverse recovery current versus di f /dt (typical values) 0.1 1.0 1.e-03 1.e-02 1.e-01 1.e+00 zth (j-c) /rth (j-c) single pulse to-220ac do-247 tp(s) 0 2 4 6 8 10 12 14 16 18 20 22 10 100 1000 i rm (a) i f = 30 a v r =320 v t j =125 c t j =25 c di f /dt(a/s)
characteristics STTH30R04-Y 4/10 docid024454 rev 1 figure 5. reverse recovery time versus di f /dt (typical values) figure 6. reverse recovery charges versus di f /dt (typical values) 0 20 40 60 80 100 120 140 160 180 10 100 1000 t rr (ns) i f = 30 a v r =320 v t j =125 c t j =25 c di f /dt(a/s) 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 10 100 1000 q rr (nc) i f = 30 a v r =320 v t j =125 c t j =25 c di f /dt(a/s) figure 7. relative variations of dynamic parameters versus junction temperature figure 8. transient peak forward voltage versus di f /dt (typical values) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 i rm q rr i f = 30 a v r =320 v t j (c) q [t ]/q [t = 125 c] and i rr j rr j rm j rm j [t ]/i [t = 125 c] 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 50 100 150 200 250 300 350 400 450 500 v fp (v) i f =30 a t j =125 c di f /dt(a/s) figure 9. forward recovery time versus di f /dt (typical values) figure 10. junction capacitance versus reverse voltage applied (typical values) 0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 100 200 300 400 500 t fr (ns) i f =30 a v fr =1.1 x v f max. t j =125c di f /dt(a/s) 10 100 1000 1 10 100 1000 c(pf) f=1mhz v osc =30mv rms t j =25c v r (v)
docid024454 rev 1 5/10 STTH30R04-Y package information 2 package information ? epoxy meets ul94, v0 ? lead-free package ? cooling method: by conduction (c) ? recommended torque value: 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. do-247 dimension definitions v h l5 l l3 v2 g f f3 l1 f2 l2 l4 v dia a d me
package information STTH30R04-Y 6/10 docid024454 rev 1 table 6. do-247 dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.85 5.15 0.191 0.203 d 2.20 2.60 0.086 0.102 e 0.40 0.80 0.015 0.031 f 1.00 1.40 0.039 0.055 f2 2.00 0.078 f3 2.00 2.40 0.078 0.094 g 10.90 0.429 h 15.45 15.75 0.608 0.620 l 19.85 20.15 0.781 0.793 l1 3.70 4.30 0.145 0.169 l2 18.50 0.728 l3 14.20 14.80 0.559 0.582 l4 34.60 1.362 l5 5.50 0.216 m 2.00 3.00 0.078 0.118 v5 5 v2 60 60 dia. 3.55 3.65 0.139 0.143
docid024454 rev 1 7/10 STTH30R04-Y package information figure 12. to-220ac dimension definitions a c d l7 ? i l5 l6 l9 l4 f h2 g l2 f1 e m
package information STTH30R04-Y 8/10 docid024454 rev 1 table 7. to-220ac dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 h2 10.00 10.40 0.393 0.409 l2 16.4 0.645 l4 13.00 14.00 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 0.102 diam. i 3.75 3.85 0.147 0.151
docid024454 rev 1 9/10 STTH30R04-Y ordering information 3 ordering information 4 revision history table 8. ordering information order code marking package weight base qty delivery mode stth30r04dy stth30r04dy to-220ac 1.86 g 50 tube stth30r04wy stth30r04wy do-247 4.40 g 30 tube table 9. document revision history date revision description of changes 30-sep-2013 1 first issue
STTH30R04-Y 10/10 docid024454 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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